1990 Buessem Award Recipient

Harold W. Stetson is a retired member of the technical staff at Heraeus, Inc., Cermalloy Division, West Conshohocken, PA. A graduate of the Pennsylvania State University, he received his B.S. in 1950 in chemistry, his M .S. in 1952, and his Ph.D. in 1956, both in ceramic science. After three years at Corning Glass Works, he joined RCA in 1959, where he invented the tape lamination-cofire process. In 1964 he became affiliated with Western Electric Corp.; his group developed an ultrasmooth 99.5% alumina substrate. Stetson cofounded Ceramic Metal Systems in 1969. He was with the Electronic Research Lab of TRW from 1973 until his retirement in 1986.

Dr. Stetson received the Samuel Geijsbeek Award from the Pacific Coast Sections of the American Ceramic Society for his invention of the cofired, laminated ceramic package and interconnection technology using cavities and vias now used worldwide in the semiconductor and computer industries.

A Fellow of the American Ceramic Society, he is a member of the Electronics Division, served as president of NICE, and is a past chair of the Philadelphia Section.

The Center for Dielectric Studies presented Dr. Stetson with the Wilhelm R. Buessem Award at the CDS Awards Dinner on May 1, 1990.